"Teledyne is a leading provider of high-tech components and systems"

Teledyne e2v

Our Scholarships

Placement location Type of Placements Offered Restrictions/Notes

Summer placements; MEng placements

* (1) No applications from non-Nato countries; (2) Candidates should specify which job/s they are interested in; (3) No 12-month placements; (4) No first-year students

2022/23 Scholarships

To be confirmed

Please ensure you specify which job/s you are applying for in your application:

  • Electronics design and FPGA development
  • Designing CMOS technologies

Who we are and what we do

Teledyne is a leading provider of high-tech components and systems with design and manufacturing footprints in the US and Europe.

  • Sophisticated electronic subsystems
  • Instrumentation and communication products
  • Engineered systems
  • Energy and power generation systems

Our innovations enable our customers innovations through access to state-of-the-art technologies, driving the next generation of systems, in signal chain semiconductor devices, full spectrum imaging and high power radio frequency solutions.

CASPA Spacecraft

Teledyne e2v has an enviable history of employing some of the best minds who work with industry and academia in commercialising technologies of the future, developing high quality products, services and turn-key solutions produced through our world class global facilities that have real benefit to the world.

Our teams’ passions have led to ground breaking improvements in cancer radiotherapy systems, ultra-high reliability in critical electronic systems and observing the effects of climate change from space.

What you could be doing during your work placement

Teledyne e2v has been trusted to design and deliver CCD and CMOS imaging sensors and sub-systems for over 150 space missions by the world’s largest space agencies, including NASA, ESA, JAXA, CSA and recently for the Russian-led World Space Observatory.

One placement will provide work experience in electronics design and FPGA development for development of CMOS image sensors and integration electronics. The second placement available will provide experience of designing CMOS technologies, including the use of design tools and understanding of test and characterisation.